Countdown to SC25 in St. Louis, MO

Schedule a meeting with Chilldyne

Explore what Chilldyne has to offer @ booth 3908

This year Chilldyne is teaming up with DDC Solutions at SC25! 

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600 kW+ Air & Liquid-to-Chip Cooling

See it in action

Fail-safe, negative pressure technology

No leaks, no worries

Cooling for NVIDIA, AMD, and Intel’s most powerful chips

Find collaboration opportunities

Explore potential collaboration on projects coming up

Engage with experts

Meet with our team to get a better understanding of negative pressure liquid cooling

Gain a competitive edge

Learn how to effectively leverage the latest liquid cooling tech in your data center.

SC25: HPC Ignites

November 17-20, 2025 / ST. Louis
The International Conference for High Performance
Computing, Networking, Storage, and Analysis
Meet with Steve, Carl, Joy and Wendy of Chilldyne at SC25

Booth: 3908

Dr. Steve Harrington

Dr. Steve Harrington

Founder and CEO
Carl 1608 blue back

Carl Tedesco

Engineering Fellow, Thermal & Mechanical Design
Joy 1409 blue back

Joy Lee

Program Director

Wendy Blue Backnew2-1

Wendy Phillippe

Sr. Director of Sales & Marketing